As semiconductor technology continues to advance, the relentless quest for smaller and more efficient chips has led companies around the world to innovate and explore new materials and designsThis pursuit has become particularly evident in Japan, where leading semiconductor materials manufacturers are strategically positioning themselves at the forefront of next-generation technology, focusing on the development of essential components for the production of 1nm chips.

One notable player in this field is DNP (Dai Nippon Printing), which has recently made significant strides in creating 1nm-level semiconductor photomasksAfter establishing a strategic partnership with the Belgian research institution Imec, DNP has developed advanced photomask technologies and has begun distributing samples to equipment manufacturersTheir ambitious goal is to achieve mass production by 2030. This collaboration primarily concentrates on photomask development for extreme ultraviolet (EUV) exposure equipment, which is critical for the advances in chip manufacturing.

To optimize its manufacturing process, DNP has implemented cutting-edge electron beam lithography techniques alongside material optimizations, resulting in an efficient production workflow

The company’s roadmap points towards the initiation of mass production of 2nm photomasks by the fiscal year 2027, aligning their timelines with that of Chinese chip manufacturer RapidusDNP expects that the global external photomask market will grow by 40% by 2027, reaching an estimated $2.67 billion.

Another significant development comes from Toppan, a major materials manufacturer in JapanToppan has begun supplying 2nm photomasks to IBM in 2023 and plans to commence mass production by the fiscal year 2026. Collaborating with Imec and IBM, Toppan is exploring advanced applications of photomask technologies that could reshape the landscape of semiconductor manufacturing.

In addition to these corporate efforts, Fujifilm is contributing crucial lithography materials essential for 1nm chip productionThe company has committed to investing ¥13 billion to establish a new research and development center, aiming to bolster the technological ecosystem surrounding these advanced chips

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Furthermore, aligning with private sector innovations, Japan's Ministry of Education has allocated ¥4 billion for next-generation semiconductor research in 2025, demonstrating a concerted effort to promote growth in this pivotal industry.

Over in France, the CEA-Leti Research Institute is playing its part as a leading entity in microelectronics researchTheir expertise in semiconductor materials, equipment, and process technologies amplifies Europe’s standing in the global semiconductor research community, opening new avenues for the 1nm technology development.

IBM, known for its pioneering role in semiconductor innovation, has also made headlines with its introduction of the world's first 2nm chip in 2021, heralding its approach towards achieving 1nm technologyThe successful development of 2nm chips not only underscores IBM’s leadership in advanced semiconductor technologies but also lays the groundwork for the future of 1nm advancements.

A significant contributor to the development of sub-1nm transistors, Imec has unveiled a comprehensive roadmap for transistor technology, targeting the 1nm scale and beyond

In May 2023, Imec detailed its strategies, highlighting potential pathways and challenges in achieving a 1nm process nodeTheir ambition sees 1nm equating to 10 angstroms, indicating an intense focus on developing products that transcend current technological boundaries.

Among major foundries, TSMC is preparing for its own foray into 1nm technologyPlanning to commence the construction of a 1nm process plant in 2026 with a projected trial production in 2027 and full-scale manufacturing in 2028, TSMC's approach encompasses not only process technology innovations but also the exploration of new materials and the development of advanced equipment, demonstrating their determination to advance 1nm technology toward commercialization.

Intel, regarded as one of the largest semiconductor firms globally, is also delving into 1nm technologyWith plans to use its Intel 4 fabrication process for the next generation of processors before transitioning to its more advanced Intel 3 technology, Intel's strategic focus remains on achieving smaller transistor sizes and greater integration, which aligns with industry trends towards scaling down dimensions.

Despite the promising strides made in developing 1nm technology, numerous challenges must be addressed

Issues regarding material selection, transistor design, the precision of manufacturing processes, and cost control remain prevalent in the discourse surrounding sub-1nm advancements.

A notable focus within this realm is the application of two-dimensional (2D) materials like molybdenum disulfide (MoS2), which has garnered attention for its atomic-thin structure and superior electronic propertiesThese materials are seen as ideal substitutes that may surpass traditional silicon in performance.

Research at Imec has revealed significant advancements in this domainFor instance, in 2019, the institute demonstrated the use of MoS2 to create microtransistors with feature sizes that fall below traditional silicon devices' short-channel effectsThese findings showcase the potential of 2D materials to facilitate manufacturing processes at the 1nm and below node.

Additionally, a partnership between TSMC, the Massachusetts Institute of Technology, and Nanyang Technological University has centered around leveraging 2D materials